Method for manufacturing micro structure using x-ray exposure

ABSTRACT

Provided is a method for fabricating a microstructure. The method includes disposing an X-ray mask on photosensitive material and exposing the photosensitive material by radiating X-rays to the photosensitive material using a side exposure scheme, etching the exposed photosensitive material, forming a mold having a micro-pattern by filing the etched photosensitive material with metal, forming a mold module by combining a plurality of molds, and forming a microstructure using the mold module.

TECHNICAL FIELD

The present invention relates to a microstructure fabricating methodand, more particularly, to a microstructure fabricating method using anx-ray exposure scheme.

BACKGROUND ART

LIGA is a fabrication technology used to create a plastic microstructureusing high energy x-rays generated by a synchrotron. LIGA was developedin the early 1980s at Germany. Many studies have been made for advancingLIGA and applications thereof. LIGA is a German acronym forLithographie, Galvanoformung, and Abformung. That is, LIGA includes aLithographie process for fabricating a plastic microstructure throughX-ray exposure, a Galvanoformung process for forming a mold insert usingelectro forming, and an Abformung process for forming a microstructureusing the mold insert. LIGA was developed for mass production with highproductivity, not designed for one time production of a microstructure.

A micro-electro-mechanical system (MEMS) technology uses an ultravioletrays (UV) exposure scheme to fabricate a microstructure. Unlike theconventional MEMS technology, LIGA uses high energy X-rays to fabricatea microstructure. Due to the high energy X-rays, a microstructure havinga high aspect ratio can be fabricated using LIGA. Furthermore, amicrostructure fabricated by LIGA has excellent surface quality. LIGAhas been used to produce micro components for optical communication,such as an optical waveguide and an optical connector, precisemechanical parts such as micro motor, and a core part for a heatexchanger and a micro reactor.

In early development stage, a Deep X-ray Lithography (DXRL) processusing high energy x-rays was mainly used. Henceforth, a UV-LIGA processusing a UV exposure scheme was introduced and used more as amicro-electro-mechanical system (MEMS) technology has been advanced.

In LIGA, a microstructure having the same shape of a final product isformed at first through an exposure process. Using the formedmicrostructure as a mother structure, a mold or a mold insert is formedby performing an electro forming process.

The final product having the same shape of the initially producedmicrostructure can be mass-produced through a molding process using themold.

In order to mass-produce various microstructures through LIGA, It isnecessary to precisely produce a mold or a mold insert. Furthermore, themold must have a high dimensional accuracy and required mechanicalproperties as well as a shape of final product. Such requirements mustbe satisfied in order to stably mass-produce final products.

Recently, various microstructure fabricating technologies have been usedto produce molds or mold inserts for mass-productions of variousmicrostructures. A mold may be produced using a precision machiningprocess or a laser process that directly processes mold material to forma mold. However, the precision machining process or the laser processhas drawbacks such as low dimensional accuracy and long production time.Due to such drawbacks, an exposure process in a semiconductor processhas been generally used. A microstructure is produced through anexposure process, and a metal mold or a metal mold insert is thenproduced by performing an electro forming process on the fabricatedmicrostructure.

As the MEMS technology has been advanced, various exposure processeshave been introduced. Such exposure process has merits of processautomation, high dimensional accuracy, and high yield. A microstructurefabricated through typical exposure process has a planar shape. It isbecause a direction of radiating light is vertical to a substrate andphotosensitive material coated on the substrate. Accordingly, it isdifficult to produce a microstructure having various 3-D shapes ofdifferent heights of inclined planes in case of the vertical exposurescheme.

A microstructure having a constant slope can be manufactured through amethod for radiating light using an inclined exposure scheme. However,only limited microstructures can be produced using the inclined exposurescheme. Further, it is very difficult to manufacture a mask used for theinclined exposure scheme, and complicated equipment is additionallyrequired to use the inclined exposure scheme. Accordingly, the inclinedexposure scheme has been used only for specific cases.

Moreover, the inclined exposure scheme also has limitation in depthexposed by X-rays. Accordingly, it is impossible to produce amicrostructure having a complicated shaped in a width direction thereofusing the inclined exposure scheme.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the invention andtherefore it may contain information that does not form the prior artthat is already known in this country to a person of ordinary skill inthe art.

[Disclosure] [Technical Problem]

The present invention has been made in an effort to provide amicrostructure fabricating method having advantages of easilyfabricating microstructures having various shapes.

[Technical Solution]

An exemplary embodiment of the present invention provides a method forfabricating a microstructure including disposing an X-ray mask onphotosensitive material and exposing the photosensitive material byradiating X-rays to the photosensitive material using a side exposurescheme, etching the exposed photosensitive material, forming a moldhaving a micro-pattern by filing the etched photosensitive material withmetal, forming a mold module by combining a plurality of molds, andforming a microstructure using the mold module.

In the exposing the photosensitive material, a Deep X-Ray Lithography(DXRL) process may be performed to expose the photosensitive material.The plurality of molds may have micro-patterns different in shape. Theforming a mold may include electro forming. In the forming a mold, metalmay be one of nickel and nickel alloy.

The micro-pattern may be a three dimensional (3-D) micro-pattern havingan irregular height of a top side. The X-ray mask may have a patternshape corresponding to a shape of a side of the microstructure. Theplurality of molds may be arranged and stacked in a length direction ofthe micro-pattern.

Another exemplary embodiment of the present invention provides a methodfor fabricating a microstructure, including disposing an X-ray mask onphotosensitive material and exposing the photosensitive material byradiating X-rays using a side exposure method, etching the exposedphotosensitive material, forming a photosensitive module by arrangingand stacking the etched photosensitive materials, forming a mold havinga micro-pattern by filling the photosensitive module with metal,andDeletedTextsforming a microstructure using the mold.

In the exposing the photosensitive material, a Deep X-Ray Lithography(DXRL) process may be performed to expose the photosensitive material.Micro-patterns may be formed at the etched photosensitive materials, andthe micro-patterns may be different from each other in shape.

The photosensitive materials may be arranged and stacked in a lengthdirection of the micro-pattern. The forming a mold may include electroforming.

In the forming a mold, metal may be one of nickel and nickel alloy. Themicro-pattern may be a three dimensional (3-D) micro-pattern having anirregular height of a top side.

The X-ray mask may have a pattern having a shape corresponding to ashape of a side of the microstructure. A protrusion may be formed at acorner of the photosensitive material to support neighbor photosensitivematerial, and the protrusion is protruded upwardly from a top side ofthe photosensitive material or downwardly from a bottom side of thephotosensitive material.

[Advantageous Effects]

According to the present exemplary embodiment, a microstructure having a3-D shaped micro-pattern can be easily fabricated. Further, a length ofa micro-pattern can be extended using a side exposure scheme and a moldmodule.

DESCRIPTION OF DRAWINGS

FIG. 1 is a flowchart that illustrates a method for fabricating amicrostructure according to the first exemplary embodiment of thepresent invention.

FIGS. 2A to 2F is diagrams for describing the method for fabricating amicrostructure according to the first exemplary embodiment of thepresent invention.

FIG. 3A is a picture of a X-ray mask fabricated according to the firstexemplary embodiment of the present invention, and FIG. 3B is a pictureshowing a pattern groove formed using the X-ray mask of FIG. 3A.

FIGS. 4A and 4B are pictures showing a mold module produced according tothe first exemplary embodiment of the present invention.

FIG. 5 is a perspective view of a mold module manufactured according tothe second exemplary embodiment of the present invention.

FIG. 6A is a picture that shows a mold core formed using a mold modulemanufactured according to the second exemplary embodiment of the presentinvention, and FIG. 6B is a picture that illustrates a polymermicrostructure manufactured using the mold core of FIG. 6A.

FIGS. 7A and 7B are pictures that illustrate a microstructuremanufactured according to the second exemplary embodiment of the presentinvention.

FIGS. 8A to 8C are diagrams that illustrate a method for fabricating amicrostructure according to the third exemplary embodiment of thepresent invention.

MODE FOR INVENTION

In the present invention, “side exposure” means a process that expose apredetermined object by radiating light to a side of the predeterminedobject, which crosses another side having a micro-pattern. Further,“micro-pattern” or “microstructure” means a pattern or a structurehaving a nano size pitch or a micro size pitch.

In the following detailed description, only certain exemplaryembodiments of the present invention have been shown and described,simply by way of illustration. As those skilled in the art wouldrealize, the described embodiments may be modified in various differentways, all without departing from the spirit or scope of the presentinvention. The drawings and description are to be regarded asillustrative in nature and not restrictive. Like reference numeralsdesignate like elements throughout the specification.

FIG. 1 is a flowchart that illustrates a method for fabricating amicrostructure according to the first exemplary embodiment of thepresent invention. FIGS. 2A to 2F is diagrams for describing the methodfor fabricating a microstructure according to the first exemplaryembodiment of the present invention.

Referring to FIG. 1, the microstructure fabricating method according tothe present exemplary embodiment includes exposing photosensitivematerial 110 at step S101, etching the photosensitive material 110 atstep S102, forming a mold at step S103, forming a mold module at stepS104, and fabricating a microstructure at step S105.

As shown in FIG. 2A, photosensitive material 110 made of PMMA isprepared. In the present exemplary embodiment, a positive photosensitivematerial is used. A negative photosensitive material, however, may beused as the photosensitive material 110 as well as the positivephotosensitive material.

Negative photosensitive material such as SU-8 stays in liquid.Accordingly, a substrate can be coated with negative photosensitivematerial at a predetermined thickness by performing spin coating. Then,soft baking is performed to solidify the negative photosensitivematerial coated on the substrate and to retain the solid state thereof.

As shown in FIG. 2B, a X-ray mask 120 is disposed on the photosensitivematerial 110 and an x-ray exposure process is performed by radiatingx-rays to the photosensitive material 110 at step S101.

The X-ray mask 120 includes an absorption part 120 b for absorbingX-rays 150, and a penetration part 120 b for not absorbing the X-rays.The absorption part 120 b may be made of gold (Au) that absorbs theX-rays 150 very well and the penetration part 120 a may be made ofvarious materials that do not absorb the X-rays 150.

A predetermined pattern 125 is formed at the X-ray mask 120. Thepredetermined pattern corresponds to a shape of a side of amicrostructure. The side of the microstructure may be a side thatcrosses and forms a corner with a top side of the microstructure, wherea micro-pattern is formed on the top side of the microstructure. When amicrostructure has a quadrangle-shaped top side, a microstructure hasfour sides. The predetermined pattern in the X-ray mask 120 has a shapecorresponding to that of a side of the microstructure wheremicro-patterns are continuously formed. In the present exemplaryembodiment, the predetermined pattern has a shape identical to that ofthe penetration part 120 a.

The X-ray mask 120 is disposed to face a predetermined side of thephotosensitive material 110 and the X-rays 150 is radiated toward theX-ray mask 120.

In case of applying such a side exposure scheme, it is advantageous touse a Deep X-ray Lithography (DXRL). The DXRL has merits of highpenetration depth and easy thickness control. Particularly, amicrostructure having high aspect ratio can be fabricated through a DXRLprocess using high energy X-rays. The DXRL process using high energyX-rays can be used to fabricate a vertical microstructure because ofhigh collimation of the X-rays. Because it is possible to fabricate amicrostructure with superior surface roughness, the DXRL process is usedin the present exemplary embodiment.

After radiating the X-ray 150, a pattern groove 115 having amicro-pattern 115 a is formed by etching the photosensitive material 110as shown in FIG. 2C. In the present exemplary embodiment, a positivephotosensitive material is exposed at X-rays and a radiated part of thepositive photosensitive material is etched. However, the presentinvention is not limited thereto. The present exemplary embodiment canbe applied to negative photosensitive material.

The micro-pattern 115 a extends in a depth direction of the patterngroove 115 because the pattern is formed in the X ray mask 120corresponding to a side of the microstructure. The top side of themicro-pattern 115 a is formed to be sloped. In order to easily form a3-D pattern having irregular height of the top side of the micro-pattern115, the side exposure method is applied.

After forming the pattern groove 115, a mold 130 is formed by fillingthe pattern groove 115 with metal as shown in FIG. 2D. The mold 130 ismade of nickel or nickel alloy. Since the nickel and nickel alloy haveexcellent mechanical strength, the nickel and nickel alloy are propermetal for fabricating a mold for mass production of a microstructure. Anelectro forming may be applied to fabricate the mold 130. A depth of thepattern groove 115 is about 2 mm. The pattern groove 115 may be easilyfilled with nickel using the electro forming.

As shown in FIG. 2E, the mold 130 having a micro-pattern 132 isseparated from the photosensitive material 110. A plurality of molds 130are manufactured using the same method described above. Then, theplurality of molds 130 are arranged as shown in FIG. 2E.

As shown, the micro-pattern 132 is formed at a top side of the mold 130.A side shape of the mold 130 corresponds to the pattern formed in theX-ray mask 120.

As shown in FIG. 2F, a mold module 200 is formed by combining theplurality of molds 130. The mold module 200 includes a lengthy-extendedmicro-pattern.

Due to penetration limitation of X-ray, it is difficult to form alengthy-extended pattern using the side exposure method. In theexemplary embodiment, the lengthy-extended micro-pattern is formed bystacking the plurality of molds. In this method, the mold module 200having the lengthy-extended micro-pattern can be formed even using theside exposure method. That is, the mold module 200 is formed by stackingthe plurality of molds in a length direction of the micro-pattern.

After forming the mold module, a microstructure 140 having amicro-pattern 145 is fabricated through an injection molding process ora hot embossing process as shown in FIG. 2G. The micro structure may bemade of metal or polymer.

As described a 3-D micro-pattern having an irregular height of a topside can be fabricated according to the present exemplary embodiment.

FIG. 3A is a picture of a X-ray mask fabricated according to the firstexemplary embodiment of the present invention, and FIG. 3B is a pictureshowing a pattern groove formed using the X-ray mask of FIG. 3A.

As shown in FIG. 3A, a X-ray mask includes a penetration part forpassing X-rays through the X-ray mask and an absorption part for notpassing X-rays through the X-ray mask.

As shown in FIG. 3B, a pattern groove is formed by performing exposureand etching after disposing the X-ray mask. Here, the pattern groove hasa depth of about 2 mm. A mold is formed by filling the pattern grooveusing an electro forming process.

FIGS. 4A and 4B are pictures showing a mold module produced according tothe first exemplary embodiment of the present invention.

FIG. 4A illustrates a mold module having a micro-pattern formed in asemicircle pillar shape. Here, a diameter of the semicircle pillarshaped pattern is about 200 μm. FIG. 4B illustrates a mold module havinga micro-pattern formed in an equilateral triangle prism shape. Here, alength of one side of the micro-pattern is about 300 μm.

FIG. 5 is a perspective view of a mold module manufactured according tothe second exemplary embodiment of the present invention.

A mold module 300 according to the present exemplary embodiment includesa plurality of molds 310, 320, and 330. The molds 321, 320, and 330include micro-patterns 312, 322, and 332, respectively. Themicro-patterns 312, 322, and 332 are different from each other in shape.The mold module 300 according to the present exemplary embodimentincludes a first mold 310, a second mold 320, and a third mold 330. Thefirst mold 310 has a rectangular parallelepiped shape micro-pattern 312.The second mold 320 and the third mold 330 have triangle shapemicro-patterns 322 and 332. Further, the micro-pattern 322 of the secondmold 320 has a height higher than that of the micro-pattern 332 of thethird mold 330.

In the present exemplary embodiment, a plurality of X-ray masks andphotosensitive material are prepared to form molds having differentshapes in order to form the mold module 300 having the micro-patterns312, 322, and 332 having different shapes.

Such a mold module can be formed by combining molds having differentshaped micro-patterns. Accordingly, a microstructure having variousmicro-patterns can be manufactured according to the present exemplaryembodiment.

FIG. 6A is a picture that shows a mold core formed using a mold modulemanufactured according to the second exemplary embodiment of the presentinvention, and FIG. 6B is a picture that illustrates a polymermicrostructure manufactured using the mold core of FIG. 6A.

Referring to FIGS. 6A and 6B, micro-patterns formed on a mold coreaccording to the present exemplary embodiment are gradually reduced insize. That is, such a microstructure can be fabricated using a moldmodule formed by combining molds micro-patterns different in size.

FIGS. 7A and 7B are pictures that illustrate a microstructuremanufactured according to the second exemplary embodiment of the presentinvention.

Referring to FIG. 7A, a first micro-pattern 410 has an equilateraltriangle shape and a length of one side is about 500 μm. A secondmicro-pattern 420 has an equilateral triangle shape and a length of oneside is about 450 μm. A third micro-pattern 430 has an equilateraltriangle shape and a length of one side is about 400 μm. A fourthmicro-pattern 440 has an equilateral triangle shape and a length of oneside is about 350 μm. A fifth micro-pattern 450 also has an equilateraltriangle shape and a length of one side is about 300 μm. A sixthmicro-pattern 460 has an equilateral triangle shape and a length of oneside is about 250 μm.

Referring to FIG. 7B, a first micro-pattern 510 has an equilateraltriangle shape and a length of one side is about 500 μm. A secondmicro-pattern 520 has a semicircular pillar shape and a diameter thereofis about 500 μm. A third micro-pattern 530 has an equilateral triangleshape and a length of one side is about 400 μm. A fourth micro-pattern540 has a semicircular pillar shape and a diameter thereof is about 400μm.

Microstructures having various shapes can be fabricated by combiningmolds having various micro-patterns as shown above.

FIGS. 8A to 8C are diagrams that illustrate a method for fabricating amicrostructure according to the third exemplary embodiment of thepresent invention.

The microstructure fabricating method according to the third exemplaryembodiment includes exposing a photosensitive material and etching theexposed photosensitive material, which are identical to those of thefirst exemplary embodiment. Accordingly, the detailed descriptionsthereof are omitted herein.

The microstructure fabricating method according to the present exemplaryembodiment includes exposing a photosensitive material, etching thephotosensitive material, forming a module by stacking photosensitivematerial layers, forming a mold, and forming a microstructure.

As shown in FIG. 8A, a photosensitive material 110 is exposed and etchedto form a pattern groove 115 having a micro-pattern 115 a in thephotosensitive material 110. The pattern groove 115 penetrates thephotosensitive material 110. The pattern groove 115 includes themicro-pattern 115 a. A photosensitive material module 160 is formed bystacking photosensitive material layers 110 each having a pattern groove115.

In order to properly stack the photosensitive material layers 110 at apredetermined position, a protrusion 117 is formed at a side of thephotosensitive material layer 110. The protrusion 117 is protrudedupwardly. Due to the protrusion 117, an upper photosensitive materiallayer can be properly positioned and stacked on a lower photosensitivematerial layer. The protrusion 117 may be formed at diagonal corners ofthe photosensitive material layer 110. The protrusion 117 has a shapebended along an edge of a corner. The protrusion 117 may be protrudedupwardly from a top side or downwardly from a bottom side of thephotosensitive material layer.

After stacking the photosensitive material 110, a mold 600 is formed byfilling the pattern groove 115 with metal using an electro formingprocess as shown in FIG. 8B. The mold 600 is separated from thephotosensitive material module as shown in FIG. 8C. The mold 600includes a pattern 620 having a lengthy-extended pattern 620.

As described above, the mold having a 3-D pattern with irregular heightcan be easily fabricated using the photosensitive material module 160formed by stacking the photosensitive material layers 110 according tothe present exemplary embodiment. Furthermore, a microstructure having awide 3-D micro-pattern can be easily fabricated using the mold 600according to the present exemplary embodiment.

While this invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

1. A method for fabricating a microstructure, comprising: disposing anX-ray mask on photosensitive material and exposing the photosensitivematerial by radiating X-rays to the photosensitive material using a sideexposure scheme; etching the exposed photosensitive material; forming amold having a micro-pattern by filing the etched photosensitive materialwith metal; forming a mold module by combining a plurality of molds; andforming a microstructure using the mold module;
 2. The method of claim1, wherein in the exposing the photosensitive material, a Deep X-RayLithography (DXRL) process is performed to expose the photosensitivematerial.
 3. The method of claim 1, wherein the plurality of molds havemicro-patterns different in shape.
 4. The method of claim 1, wherein theforming a mold includes electro forming.
 5. The method of claim 4,wherein in the forming a mold, metal is one of nickel and nickel alloy.6. The method of claim 1, wherein the micro-pattern is a threedimensional (3-D) micro-pattern having an irregular height of a topside.
 7. The method of claim 1, wherein: the X-ray mask has a patternshape corresponding to a shape of a side of the microstructure.
 8. Themethod of claim 1, wherein the plurality of molds is arranged andstacked in a length direction of the micro-pattern.
 9. A method forfabricating a microstructure, comprising; disposing an X-ray mask onphotosensitive material and exposing the photosensitive material byradiating X-rays using a side exposure method; etching the exposedphotosensitive material; forming a photosensitive module by arrangingand stacking the etched photosensitive materials; forming a mold havinga micro-pattern by filling the photosensitive module with metal; andforming a microstructure using the mold.
 10. The method of claim 9,wherein in the exposing the photosensitive material, a Deep X-RayLithography (DXRL) process is performed to expose the photosensitivematerial.
 11. The method of claim 9, wherein: micro-patterns are formedat the etched photosensitive materials, and the micro-patterns aredifferent from each other in shape.
 12. The method of claim 11, wherein:the photosensitive materials are arranged and stacked in a lengthdirection of the micro-pattern.
 13. The method of claim 9, wherein theforming a mold includes electro forming.
 14. The method of claim 13,wherein in the forming a mold, metal is one of nickel and nickel alloy.15. The method of claim 9, wherein the micro-pattern is a threedimensional (3-D) micro-pattern having an irregular height of a topside.
 16. The method of claim 9, wherein the X-ray mask has a patternhaving a shape corresponding to a shape of a side of the microstructure.17. The method of claim 9, wherein a protrusion is formed at a corner ofthe photosensitive material to support neighbor photosensitive material,and the protrusion is protruded upwardly from a top side of thephotosensitive material or downwardly from a bottom side of thephotosensitive material.